COOLER MODEL / C008
AXP-90 FULL BACK
Thermalright · 早期 AXP-90 下吹式/全銅
Published specifications, derived values, and TK Lab physical notes are labelled separately. Missing fields are never filled from a merely similar product.
PHYSICAL SPECIFICATION
Heatsink construction and specifications
With fan490 g
Without fan435 g
Thermalright never explained the FULL BACK name. Dimensions and complete mass reference the archived AXP-90R FULL; 435g is derived by subtracting a 55g fan.
- Layout
- 早期 AXP-90 下吹式/全銅
- Heatpipes
- 4 × Ø6 mm · 全銅
- Fins
- 全銅 · 57 fins
- Fin thickness / gap
- 0.3 mm / 1.6 mm
- Base material
- C1100 純銅
- CPU contact surface
- C1100 純銅底座鍍鎳
- Surface finish
- 全銅鍍鎳黑化
- Socket support
- 依 i/R 扣具版本;TK Lab 個體為 AMD 系列
- Official thermal rating
- Not published
- Fan support
- 92 × 15 mm 原生孔位;改裝可用 92 × 25 或轉接 120mm
- RAM clearance
- Not published / pending fit test
- PCIe / motherboard clearance
- Not published / pending fit test
- Mounting
- Depends on supplied mounting revision
- Warranty
- Not published
Fitment and interference note
Not written yet. Add verified motherboard, memory, or case fitment observations from the admin panel.
A heatsink-only mass derived from official complete and fan weights is explicitly labelled as calculated. Coatings, mounting revisions, and production batches can still change the result.
Included fan
The model comes directly from the fan catalog. The searchable relationship remains available even before photos are published.
COOLER × FAN × TEST
Related tests
History and sample notes
This section will hold launch history, naming changes, material versions, discontinuation status, sources, and differences between physical samples. Long-form research links to a note instead of being duplicated across test pages.