COOLER MODEL / C010
AXP-90/R Full Copper Graphene
Thermalright · 早期 AXP-90 下吹式/全銅
Published specifications, derived values, and TK Lab physical notes are labelled separately. Missing fields are never filled from a merely similar product.
PHYSICAL SPECIFICATION
Heatsink construction and specifications
With fan490 g
Without fan435 g
The Graphene and bare-copper versions use the same heatsink; the Graphene coating is the only structural variant. Dimensions and construction follow the archived AXP-90R FULL copper model. The 435g mass is derived by subtracting a 55g fan.
- Layout
- 早期 AXP-90 下吹式/全銅
- Heatpipes
- 4 × Ø6 mm · 全銅
- Fins
- 全銅 · 57 fins
- Fin thickness / gap
- 0.3 mm / 1.6 mm
- Base material
- C1100 純銅
- CPU contact surface
- C1100 純銅底座
- Surface finish
- 石墨烯黑色塗層
- Socket support
- AMD AM4(R 版原生)
- Official thermal rating
- Not published
- Fan support
- 92 × 15 mm 原生孔位;改裝可用 92 × 25 或轉接 120mm
- RAM clearance
- Not published / pending fit test
- PCIe / motherboard clearance
- Not published / pending fit test
- Mounting
- Depends on supplied mounting revision
- Warranty
- Not published
Fitment and interference note
Not written yet. Add verified motherboard, memory, or case fitment observations from the admin panel.
A heatsink-only mass derived from official complete and fan weights is explicitly labelled as calculated. Coatings, mounting revisions, and production batches can still change the result.
Included fan
The model comes directly from the fan catalog. The searchable relationship remains available even before photos are published.
COOLER × FAN × TEST
Related tests
History and sample notes
This section will hold launch history, naming changes, material versions, discontinuation status, sources, and differences between physical samples. Long-form research links to a note instead of being duplicated across test pages.