/Coolers/ID-COOLING IS-60 EVO
COOLER MODEL / C001
ID-COOLING IS-60 EVO
ID-COOLING · 下吹式／雙風扇
Published specifications, derived values, and TK Lab physical notes are labelled separately. Missing fields are never filled from a merely similar product.
PHYSICAL SPECIFICATION
Heatsink construction and specifications
SIZE / MASS
Overall dimensions (L × W × H)120 × 122 × 64 mm
Heatsink dimensions (L × W × H)Not separately published
With fan650 g
Without fan—
The manufacturer publishes only the complete dual-fan weight, not heatsink-only mass.
- Layout
- 下吹式／雙風扇
- Heatpipes
- 6 × Ø6 mm · 銅
- Fins
- 鋁
- Fin thickness / gap
- Not published
- Base material
- 銅底
- CPU contact surface
- 銅底直觸介面
- Surface finish
- 黑化鋁鰭片／銅熱管
- Socket support
- Intel LGA1200/115x；LGA1700/1851 視通路扣具；AMD AM4
- Official thermal rating
- 130 W TDP
- Fan support
- 上層 120 × 15 mm、下層 92 × 15 mm；上層可用 120 × 25 mm（需另備 KM3×28 螺絲）
- RAM clearance
- Not published / pending fit test
- PCIe / motherboard clearance
- Not published / pending fit test
- Mounting
- Depends on supplied mounting revision
- Warranty
- Not published
Source: ID-COOLING 官方規格Open specification source ↗
TK LAB / FITMENT NOTE
Fitment and interference note
Not written yet. Add verified motherboard, memory, or case fitment observations from the admin panel.
A heatsink-only mass derived from official complete and fan weights is explicitly labelled as calculated. Coatings, mounting revisions, and production batches can still change the result.
STOCK FAN
Included fan
The model comes directly from the fan catalog. The searchable relationship remains available even before photos are published.
COOLER × FAN × TEST
Related tests
Dual-fan configuration
Dual-fan configuration
History and sample notes
This section will hold launch history, naming changes, material versions, discontinuation status, sources, and differences between physical samples. Long-form research links to a note instead of being duplicated across test pages.